Job Description
Job Title: Principal Assembly Engineer (Microelectronics - mmWave - IC Packaging)
Our Client: Our client, a leading technology solutions provider, specializes in offering innovative engineering services and products in sectors like wireless communications, RF microwave, and semiconductors. With a focus on cutting-edge technology and sustainable solutions, the company provides comprehensive support from product development to market launch, helping clients across various industries meet their evolving needs.
This role focuses on designing and implementing die attach and wirebond processes for New Product Introduction (NPI) solutions in microwave and mmWave IC packaging for high-frequency applications. The candidate will also enhance existing packaging processes to improve yield and productivity, collaborating with internal teams and packaging suppliers to achieve functional packaging objectives.
Work location: Ang Mo Kio
The Responsibilities:
* Serve as the subject matter expert for the microelectronics assembly team, advising Design Engineering during early product development to ensure manufacturability
* Operate, set up, and supervise die attach and wirebonding equipment for all microelectronics assembly processes
* Develop and test standards and guidelines for microelectronics packaging solutions in aerospace and defense applications
* Define, develop, and qualify new packaging designs, including leadframe/substrate layouts, bonding diagrams, and package outline drawings
* Establish and document stable, repeatable assembly processes that meet design requirements
* Lead prototype, first article, and pre-production assembly builds
* Support customer products throughout their lifecycle, implementing necessary changes
* Work with RF ICs, capacitors, inductors, substrates, and other micro components in hybrid technologies
* Analyze prototype and released assembly drawings to ensure compliance with quality standards
The Requirements:
* 5-7 years of microelectronics assembly experience, preferably in a manufacturing environment involving similar processes
* Strong knowledge of microelectronics assembly workflows and packaging design validation standards (e.g., ISO, ASTM)
* Familiarity with industrial standards like JEDEC is advantageous
* Experience operating microelectronics equipment, including epoxy die-attach, eutectic solder attach, wire bonding, pull/shear testing, and leak testing
* Skilled in analysing technical and assembly drawings, making process improvement recommendations
* Proficiency in assembly jig design and 2D/3D mechanical CAD software preferred
All shortlisted candidates will be contacted
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Disclaimer: The Company complies with the Tripartite Guidelines on Fair Employment Practices (TGFEP), including the prevailing guidelines on recruitment. All qualified applicants will be considered for the position regardless of their age, race, religion, nationality, marital status, or family responsibilities. A more detailed discussion of the TGFEP is available on the Tripartite Alliance for Fair and Progressive Employment Practices (TAFEP) website at https://www.tal.sg/tafep
JO Reference: JO-241209-371637